Silicon Etch
North Cleanroom
1.750
RIE/ ICP Etcher
Features: Central Vacuum Transport for a full 25 wafer lot
Up to 8inch wafer
Only full size wafer can be loaded. Make sure to place your pieces /coupons on a carrier wafer.
Reactor #2, Chuck with Helium back side cooling (-30°C), ICP head.
Turbo pump on each chambers
RIE quartz etch in Trion Chamber #3
CF4=15sccm
He=40sccm
130W
15mTorr
rate: 30nm/min.
RIE Chrome etch in Trion Chamber #3
Cl2=40sccm
O2=10sccm
80W
30mTorr
rate: 6nm/min
reactor 1: CF4, SF6, O2, Argon, N2, CHF3, He
reactor2: SO2, O2, CO2, Argon, N2, C2H6, He
reactor 3: Cl2, He, CF4, He, O2
Compatible Materials:
IMPRIO related project
Incompatible Materials:
Metals other than chrome
The Oracle cluster system consists of two components:
1) Central Vacuum Transport (CVT)
2) 3 “roll-away” process reactors
The “roll-aways” are docked to the CVT in a cluster configuration.
The system is configured with single wafer loading or for full production with vacuum cassette elevators.